Underfill film for printed wiring assemblies
US7265994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2003 |
| Grant date | Sep 4, 2007 |
| Priority date | — |
| Expiry date | Mar 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.