Method and apparatus for orienting semiconductor wafers in semiconductor fabrication
US7268877B2 · kind B2 · utility
2Cited by
8References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Jan 23, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/7019
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Described are systems and methods for orienting a semiconductor wafer during semiconductor fabrication with the aid of an optical alignment system, the semiconductor wafer having an alignment mark with regular structures, on the basis of which the position of the semiconductor wafer can be determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.