Ceramic optical sub-assembly for optoelectronic modules

US7269027B2 · kind B2 · utility

Assignee

• NATIONAL SEMICONDUCTOR CORPORATION · US

Inventors

• Jia Liu · Wuxi, CN
• Luu Thanh Nguyen · San Jose, US
• Ken Pham · San Jose, US
• William Paul Mazotti · San Martin, US
• Bruce Carlton Roberts · San Jose, US
• Stephen Gee · Danville, US
• John P. Briant · Cambridge, GB

Key dates

• Filing date: Jan 31, 2006
• Grant date: Sep 11, 2007
• Expiry date: Jan 31, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/4025
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconducto…