Heating configuration for use in thermal processing chambers
US7269343B2 · kind B2 · utility
19Cited by
129References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2005 |
| Grant date | Sep 11, 2007 |
| Priority date | — |
| Expiry date | Aug 14, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B31/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.