Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7271482B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2004 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Dec 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces having such interconnects are disclosed herein. One aspect of the invention is directed toward a method for manufacturing a microelectronic workpiece having a plurality of microelectronic dies. The individual dies include an integrated circuit and a terminal electrically coupled to the integrated circuit. In one embodiment, the method includes forming an opening in the workpiece in alignment with the terminal. The opening can be a through-hole extending through the workpiece or a blind hole that extends only partially through the substrate. The method continues by constructing an electrically conductive interconnect in the workpiece by depositing a solder material into at least a portion of the opening and in electrical contact with the terminal. In embodiments that include forming a blind hole, the workpiece can be thinned either before or after forming the hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.