Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
US7271908B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 18, 2005 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | May 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4638
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.