Thermally conductive integrated circuit mounting structures
US7272010B1 · kind B1 · utility
4Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2006 |
| Grant date | Sep 18, 2007 |
| Priority date | — |
| Expiry date | Feb 17, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various devices for mounting circuit devices and methods of making the same are provided. In aspect, a device is provided that includes a member for holding an integrated circuit. The member contains a first plurality of carbon nanotubes to enhance the thermal conductivity thereof. At least one conductor member projects from the member. In another aspect, a method of fabricating an interface for an electronic component is provided that includes forming a member containing a first plurality of carbon nanotubes and forming at least one conductor on the member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.