Semiconductor device and manufacturing method thereof
US7274103B2 · kind B2 · utility
3Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Nov 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a melting point of 260° C. or higher and an intermetallic compound with a melting point of 260° C. or higher. Specifically, by connecting them using Pb-free solder with a melting point of 260° C. or lower, the printed board capable of lowering in cost, lightening, and reducing back height can be applied to a module board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.