System and method for determining the temperature of a semiconductor wafer
US7274867B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 25, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Aug 25, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorded from the time of thermal contact up to the time of thermal equilibrium between the semiconductor wafer and the temperature sensing element and the temperature of the semiconductor wafer at the time of thermal contact is determined on the basis of a time period between the time of thermal contact and the time of thermal equilibrium and the temperature TG of the semiconductor wafer reached at the time tG of thermal equilibrium is determined by back calculation with the aid of an equation derived from Newton's law of cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.