Retaining ring with conductive portion
US7276743B2 · kind B2 · utility
6Cited by
12References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2005 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Sep 9, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.