Conductive polishing article for electrochemical mechanical polishing

US7278911B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Paul D. Butterfield · San Jose, US
• Liang-Yuh Chen · San Jose, US
• Yonqi Hu · San Jose, US
• Antoine P. Manens · Palo Alto, US
• Rashid Mavliev · Truckee, US
• Stan Tsai · Clifton Park, US
• Feng Q. Liu · San Jose, US
• Ralph Wadensweiler · Sunnyvale, US
• Lizhong Sun · San Jose, US
• Siew Neo · Sunnyvale, US
• Alain Duboust · Sunnyvale, US

Key dates

• Filing date: Aug 30, 2005
• Grant date: Oct 9, 2007
• Expiry date: Aug 30, 2025

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/32125
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.