Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method
US7279079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | May 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use; and an undiluted replacement liquid supplying section for supplying an undiluted replacement liquid as a source of the replacement liquid into the buffer container. Copper mesh members each prepared by weaving a copper wire, straight copper pipes or copper plates are accommodated as a copper source in each of the copper dissolution tanks. The copper dissolution tanks each include a detachable cartridge, in which the copper mesh members or the like are disposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.