Hideaki Matsubara
11Patents
5h-index
32Co-inventors
66Inventor score
Filing activity: Dec 21, 1993 → Oct 15, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5475319A | Method of measuring electric charge of semiconductor wafer | Electricity | 12 | Expired |
| US7410545B2 | Substrate processing method of and substrate processing apparatus for freezing and cleaning substrate | Emerging Cross-Sectional Technologies | 8 | Active |
| US5554939A | Non-destructive measuring sensor for semiconductor wafer and method of manufacturing the same | Physics | 8 | Expired |
| US7364806B2 | Thermal barrier coating system method of manufacturing the same | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7169269B2 | Plating apparatus, plating cup and cathode ring | Chemistry; Metallurgy | 5 | Expired |
| US7025946B2 | Method for producing soft magnetic hexagonal ferrite sintered material and soft magnetic hexagonal ferrite sintered material | Chemistry; Metallurgy | 3 | Expired |
| US5504437A | Apparatus and method for electrical measurement of semiconductor wafers | Physics | 2 | Expired |
| US7785671B2 | Thermal barrier coating system and method of manufacturing the same | Emerging Cross-Sectional Technologies | 2 | Active |
| US9120704B2 | Dielectric layer for electrostatic chuck and electrostatic chuck | Emerging Cross-Sectional Technologies | 1 | Active |
| US6660665B2 | Platen for electrostatic wafer clamping apparatus | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7279079B2 | Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating method | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.