FBGA and COB package structure for image sensor
US7279782B2 · kind B2 · utility
13Cited by
5References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Sep 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8063
Abstract
A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.