Stacked die package system
US7279785B2 · kind B2 · utility
4Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Dec 6, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked die package system including forming a bottom package including a bottom substrate and a bottom die mounted and electrically connected under the bottom substrate and forming a top package including a top substrate and a top die mounted and electrically connected over the top substrate. Mounting the top package by the top substrate over the bottom substrate and electrically connecting the bottom and top substrates. Mounting system electrical connectors under the bottom substrate adjacent the bottom die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.