Inventor · Seoul, KR

Jong-Woo Ha

56Patents

11h-index

48Co-inventors

74Inventor score

Filing activity: Nov 12, 2005 → May 22, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US7288835B2	Integrated circuit package-in-package system	Electricity	77	Expired
US7368319B2	Stacked integrated circuit package-in-package system	Electricity	65	Active
US9330945B2	Integrated circuit package system with multi-chip module	Electricity	34	Active
US8067268B2	Stacked integrated circuit package system and method for manufacturing thereof	Electricity	23	Active
US7750454B2	Stacked integrated circuit package system	Electricity	20	Active
US7420269B2	Stacked integrated circuit package-in-package system	Electricity	20	Active
US7687897B2	Mountable integrated circuit package-in-package system with adhesive spacing structures	Electricity	13	Active
US7888184B2	Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof	Electricity	13	Active
US7659609B2	Integrated circuit package-in-package system with carrier interposer	Electricity	12	Active
US8531043B2	Planar encapsulation and mold cavity package in package system	Electricity	11	Active
US7498667B2	Stacked integrated circuit package-in-package system	Electricity	11	Active
US9355962B2	Integrated circuit package stacking system with redistribution and method of manufacture thereof	Electricity	10	Active
US7501697B2	Integrated circuit package system	Electricity	10	Active
US7927917B2	Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof	Electricity	10	Active
US7456088B2	Integrated circuit package system including stacked die	Electricity	8	Active
US8405197B2	Integrated circuit packaging system with stacked configuration and method of manufacture thereof	Electricity	7	Active
US8957530B2	Integrated circuit packaging system with embedded circuitry and post	Electricity	6	Active
US7915724B2	Integrated circuit packaging system with base structure device	Electricity	5	Active
US7652376B2	Integrated circuit package system including stacked die	Electricity	5	Active
US7872340B2	Integrated circuit package system employing an offset stacked configuration	Electricity	5	Active
US8810018B2	Stacked integrated circuit package system with face to face stack configuration	Electricity	5	Active
US7635913B2	Stacked integrated circuit package-in-package system	Electricity	5	Active
US7279785B2	Stacked die package system	Electricity	4	Expired
US7968373B2	Integrated circuit package on package system	Electricity	4	Active
US9236319B2	Stacked integrated circuit package system	Electricity	4	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.