Patent · US Active

Pad assembly for electrochemical mechanical polishing

US7285036B2 · kind B2 · utility

14Cited by

228References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Shou-Sung Chang · Mountain View, US
Stan Tsai · Clifton Park, US
Donald Olgado · Mountain View, US
Liang-Yuh Chen · San Jose, US
Alain Duboust · Sunnyvale, US
Ralph Wadensweiler · Sunnyvale, US

Key dates

Filing date	Nov 21, 2006
Grant date	Oct 23, 2007
Priority date	—
Expiry date	Nov 21, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/32125
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.