Multi chamber plasma process system
US7285916B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Apr 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32183
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-chamber plasma process system includes a plurality of process chambers, each of which has an inductively coupled plasma generator. The inductively coupled plasma generator is electrically connected to a main power supply through a first impedance matcher. The first impedance matcher has at least one variable inductor. Ignition electrodes of the inductively coupled plasma generators are connected in parallel with an ignition power supply configured as a variable transformer. The variable inductor of the first impedance matcher and the variable transformer of the ignition power supply are controlled by a controller. Each process chamber has a plasma density regulator. Power supply systems, including an ignition power source, a radio frequency (RF) power source, an impedance matcher, etc. can be effectively integrated. As a result, it is possible to decrease the area of facilities and the cost of the system, and to individually control the plasma density of each process chamber. Accordingly, process yield is improved, and productivity of the system is further improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.