Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
US7285971B2 · kind B2 · utility
3Cited by
9References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Jan 4, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing apparatus and method for testing integrated circuits is disclosed wherein a device under test is continuously maintained at a desired set point temperature by an included thermal body. The thermal body has an enclosed phase change material which provides latent heat to the device under test such that there is negligible temperature variation realized by integrated circuits being tested.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.