Patent · US Expired

Method of fabricating heteroepitaxial microstructures

US7288430B2 · kind B2 · utility

8Cited by
13References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 24, 2005
Grant dateOct 30, 2007
Priority date
Expiry dateJan 11, 2026

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/76254
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

An efficient method of fabricating a high-quality heteroepitaxial microstructure having a smooth surface. The method includes detaching a layer from a base structure to provide a carrier substrate having a detached surface, and then forming a heteroepitaxial microstructure on the detached surface of the carrier substrate by depositing an epitaxial layer on the detached surface of a carrier substrate. Also included is a heteroepitaxial microstructure fabricated from such method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.