System and method for patterning a flexible substrate in a lithography tool
US7292308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2005 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method are used to feed a flexible substrate through a patterned beam to be exposed at target portions by the pattered beam. In one example, the flexible substrate is passed over a chuck (e.g., a vacuum chuck). In one example, the chuck can bias the flexible substrate against a chuck surface during alignment, focus, and exposure operations. By biasing the flexible substrate, the flexible substrate can continuously move while being held against the chuck. In one example, the flexible substrate is fed onto the vacuum chuck from a supply roller and fed off the chuck and wrapped on to a take-up roller. The supply and take-up rollers are rotated to follow the scanning motion, which minimizes or substantially eliminates tension on the flexible substrate during the exposure period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.