Apparatus and method for making circuitized substrates in a continuous manner
US7293355B2 · kind B2 · utility
13Cited by
35References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2005 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Feb 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53204
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.