CMOS-compatible non-volatile memory cell with lateral inter-poly programming layer
US7294888B1 · kind B1 · utility
15Cited by
3References
14Claims
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Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Mar 8, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C16/0466
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electrically erasable programmable read-only memory (“CMOS NON-VOLATILE MEMORY”) cell is fabricated using standard CMOS fabrication processes. First and second polysilicon gates are patterned over an active area of the cell between source and drain regions. Thermal oxide is grown on the polysilicon gates to provide an isolating layer. Silicon nitride is deposited between the first and second polysilicon gates to form a lateral programming layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.