Patent · US Expired

Electronic component with multilayered rewiring plate and method for producing the same

US7294910B2 · kind B2 · utility

13Cited by

7References

28Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Jochen Thomas · Munich, DE
Ingo Wennemuth · Munich, DE

Key dates

Filing date	Jun 30, 2003
Grant date	Nov 13, 2007
Priority date	—
Expiry date	Jun 30, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.