Plating solutions for electroless deposition of copper
US7297190B1 · kind B1 · utility
13Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2006 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Jun 28, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.