William Thie
33Patents
7h-index
40Co-inventors
65Inventor score
Filing activity: Feb 6, 2003 → Oct 19, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7829152B2 | Electroless plating method and apparatus | Electricity | 16 | Active |
| US8404626B2 | Post-deposition cleaning methods and formulations for substrates with cap layers | Chemistry; Metallurgy | 15 | Active |
| US7297190B1 | Plating solutions for electroless deposition of copper | Chemistry; Metallurgy | 13 | Active |
| US8241701B2 | Processes and systems for engineering a barrier surface for copper deposition | Electricity | 11 | Active |
| US8771804B2 | Processes and systems for engineering a copper surface for selective metal deposition | Electricity | 8 | Active |
| US8747960B2 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | Emerging Cross-Sectional Technologies | 7 | Active |
| US8622020B2 | Simultaneous electroless plating of two substrates | Electricity | 7 | Active |
| US8026605B2 | Interconnect structure and method of manufacturing a damascene structure | Electricity | 5 | Active |
| US7040332B2 | Method and apparatus for megasonic cleaning with reflected acoustic waves | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8883027B2 | Methods for removing a metal oxide from a substrate | Electricity | 5 | Active |
| US6995067B2 | Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7662253B2 | Apparatus for the removal of a metal oxide from a substrate and methods therefor | Electricity | 4 | Active |
| US9117860B2 | Controlled ambient system for interface engineering | Electricity | 3 | Active |
| US8133812B2 | Methods and systems for barrier layer surface passivation | Electricity | 3 | Active |
| US8691698B2 | Controlled gas mixing for smooth sidewall rapid alternating etch process | Electricity | 3 | Active |
| US8603913B1 | Porous dielectrics K value restoration by thermal treatment and or solvent treatment | Electricity | 2 | Active |
| US7752996B2 | Apparatus for applying a plating solution for electroless deposition | Emerging Cross-Sectional Technologies | 2 | Active |
| US7592259B2 | Methods and systems for barrier layer surface passivation | Electricity | 2 | Active |
| US8485120B2 | Method and apparatus for wafer electroless plating | Electricity | 1 | Active |
| US7358186B2 | Method and apparatus for material deposition in semiconductor fabrication | Electricity | 1 | Expired |
| US7709400B2 | Thermal methods for cleaning post-CMP wafers | Electricity | 1 | Active |
| US7875554B2 | Method for electroless depositing a material on a surface of a wafer | Electricity | 1 | Active |
| US8490573B2 | Method and apparatus for material deposition | Electricity | 1 | Active |
| US8790465B2 | Post-deposition cleaning methods for substrates with cap layers | Chemistry; Metallurgy | 1 | Active |
| US8314027B2 | Wafer electroless plating system and associated methods | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.