Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
US7297239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2004 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Apr 18, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrochemical apparatus is provided which deposits material onto or removes material from the surface of a workpiece. The apparatus comprises a polishing pad and a platen which is in turn comprised of a first conductive layer in contact with the polishing pad and coupled to a first potential, a second conductive layer coupled to a second potential, and a first insulating layer disposed between the first and second conductive layers. At least one electrical contact is positioned within the polishing pad and is electrically coupled to the second conductive layer. A reservoir is provided which places an electrolyte solution in contact with the polishing pad and the workpiece. A carrier positions and/or presses the workpiece against the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.