Multi-chip device and method for producing a multi-chip device
US7297574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Aug 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a multi-chip device comprising a plurality of chip stacks each including a plurality of single chips stacked on each other, wherein the stacked single chips are electrically interconnected by one or more through-chip-connection extending through at least one of the single chips and a substrate providing one or more first contact elements each of which is in contact with one of the through-chip-connections and providing one or more second contact elements being in electrical contact with the first contact elements, wherein the plurality of chip stacks are stacked onto each other and wherein the second contact elements of one of the chip stacks each being arranged to be in contact to one or more third contact elements of an adjacent one of the chip stacks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.