Method for multi-step temperature control of a substrate
US7297894B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Sep 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of changing the temperature of a substrate during processing of the substrate includes providing the substrate on a substrate holder, the substrate holder including a temperature controlled substrate support for supporting the substrate, a temperature controlled base support for supporting the substrate support and a thermal insulator interposed between the temperature controlled substrate support and the temperature controlled base support. The method further includes setting the temperature of the base support to a first base temperature corresponding to a first processing temperature of the substrate, setting the substrate support to a first support temperature corresponding to the first processing temperature of the substrate, setting the temperature of the base support to a second base temperature corresponding to a second processing temperature of the substrate, and setting the substrate support to a second support temperature corresponding to the second processing temperature of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.