Multiple substrate microelectronic devices and methods of manufacture
US7298031B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2000 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Nov 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each microelectronic substrate can include a first surface, a second surface opposite the first surface, and a functional microelectronic feature coupled to a connection terminal of the microelectronic substrate. The connection terminals can be coupled to a support member, such as a leadframe or a printed circuit board, with the bond plane between the microelectronic substrates either aligned with or transverse to the support member. The microelectronic substrates can be enclosed in a protective packaging material that can include a transparent window to allow selected radiation to strike one or the other of the microelectronic substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.