Inventor · Caldwell, ID, US

J. Michael Brooks

23Patents
6h-index
10Co-inventors
66Inventor score

Filing activity: Dec 4, 1998 → Apr 23, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US7910385B2 Method of fabricating microelectronic devices Electricity 46 Active
US9362208B2 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Electricity 18 Active
US7655500B2 Packaged microelectronic devices and methods for packaging microelectronic devices Electricity 9 Active
US8138021B2 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Emerging Cross-Sectional Technologies 8 Active
US7750449B2 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Electricity 6 Active
US7759785B2 Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Emerging Cross-Sectional Technologies 6 Active
US7329949B2 Packaged microelectronic devices and methods for packaging microelectronic devices Electricity 5 Expired
US7550847B2 Packaged microelectronic devices and methods for packaging microelectronic devices Electricity 3 Active
US7253025B2 Multiple substrate microelectronic devices and methods of manufacture Electricity 2 Expired
US6535393B2 Electrical device allowing for increased device densities Electricity 2 Expired
US7955898B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Electricity 2 Active
US8138613B2 Microelectronic devices Electricity 1 Active
US9960094B2 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Electricity 1 Active
US10763185B2 Packaged semiconductor components having substantially rigid support members Electricity 0 Active
US9812415B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Electricity 0 Active
US10692827B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Electricity 0 Active
US7298031B1 Multiple substrate microelectronic devices and methods of manufacture Electricity 0 Expired
US8866272B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Electricity 0 Active
US6914198B2 Electrical device allowing for increased device densities Electricity 0 Expired
US10312173B2 Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components Electricity 0 Active
US6909055B2 Electrical device allowing for increased device densities Electricity 0 Expired
US10163826B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Electricity 0 Active
US7084351B2 Electrical device allowing for increased device densities Electricity 0 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.