Polished state monitoring apparatus and polishing apparatus using the same
US7300332B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Jun 16, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polished state monitoring apparatus capable of easily grasping the progress of polishing is provided. The polished state monitoring apparatus monitors the progress of polishing of a surface to be polished by obtaining a characteristic value indicating a state of the polished surface of an object at each sampling point every predetermined interval while scanning the surface. The apparatus includes light emitting means capable of emitting light for irradiating the surface and computing units for receiving light reflected from the surface to generate a characteristic value. Then, the apparatus fetches the characteristic values obtained from the sampling points at the same sampling timing during each scan and outputs the characteristic values. This enables the progress of the polishing to be monitored in accordance with the distance from the center of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.