Adhesive assembly for a circuit board
US7300820B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2004 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Mar 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.