Semiconductor device module with flip chip devices on a common lead frame
US7301235B2 · kind B2 · utility
34Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2005 |
| Grant date | Nov 27, 2007 |
| Priority date | — |
| Expiry date | Jun 3, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.