Semiconductor chip packaging method with individually placed film adhesive pieces
US7306971B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2004 |
| Grant date | Dec 11, 2007 |
| Priority date | — |
| Expiry date | Oct 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Individual pieces of film adhesive (42) are placed on a support surface (46). Diced semiconductor chips (24) are individually placed on the individual pieces of the film adhesive thereby securing the diced semiconductor chips to the support surface to create first chip subassemblies (52). The diced semiconductor chip and support surface of each of a plurality of the first chip subassemblies are electrically connected, such as by wires (54), to create second chip subassemblies ((56). At least a portion of at least some of the second chip subassemblies are encapsulated, such as with molding compound (58), to create semiconductor chip packages (60).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.