Inventor · Seoul, KR

Hyeog Chan Kwon

20Patents
5h-index
16Co-inventors
58Inventor score

Filing activity: Oct 29, 2004 → Jun 15, 2011

Most-cited inventions

PatentTitleAreaCited byStatus
US7288835B2 Integrated circuit package-in-package system Electricity 77 Expired
US7737539B2 Integrated circuit package system including honeycomb molding Electricity 21 Expired
US8375576B2 Method for manufacturing wafer scale heat slug system Emerging Cross-Sectional Technologies 11 Active
US7501697B2 Integrated circuit package system Electricity 10 Active
US7456088B2 Integrated circuit package system including stacked die Electricity 8 Active
US8030134B2 Stacked semiconductor package having adhesive/spacer structure and insulation Electricity 5 Active
US7652376B2 Integrated circuit package system including stacked die Electricity 5 Active
US7975377B2 Wafer scale heat slug system Emerging Cross-Sectional Technologies 4 Active
US8067831B2 Integrated circuit package system with planar interconnects Electricity 4 Expired
US8623704B2 Adhesive/spacer island structure for multiple die package Electricity 4 Active
US7884460B2 Integrated circuit packaging system with carrier and method of manufacture thereof Electricity 4 Active
US7545031B2 Multipackage module having stacked packages with asymmetrically arranged die and molding Electricity 4 Active
US7755180B2 Integrated circuit package-in-package system Electricity 3 Active
US8552551B2 Adhesive/spacer island structure for stacking over wire bonded die Electricity 2 Active
US7875966B2 Stacked integrated circuit and package system Electricity 2 Active
US8217501B2 Integrated circuit package system including honeycomb molding Electricity 1 Active
US7306971B2 Semiconductor chip packaging method with individually placed film adhesive pieces Electricity 0 Expired
US8102043B2 Stacked integrated circuit and package system and method for manufacturing thereof Electricity 0 Active
US8049322B2 Integrated circuit package-in-package system and method for making thereof Electricity 0 Active
US7932593B2 Multipackage module having stacked packages with asymmetrically arranged die and molding Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.