Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold
US7309447B2 · kind B2 · utility
1Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2004 |
| Grant date | Dec 18, 2007 |
| Priority date | — |
| Expiry date | Feb 3, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.