Two position anneal chamber
US7311810B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Apr 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention generally provide an annealing apparatus and method for a semiconductor processing platform. The annealing apparatus includes a plurality of isolated annealing chambers, wherein each of the annealing chambers has a heating plate positioned in a sealed processing volume, a cooling plate positioned in the processing volume, and a substrate transfer mechanism positioned in the processing volume and configured to transfer substrates between the heating plate and the cooling plate. The annealing system further includes a gas supply source selectively in communication with each of the individual annealing chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.