Thermal interface adhesive and rework
US7312261B2 · kind B2 · utility
18Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2004 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.