Enhanced via structure for organic module performance
US7312523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | Dec 25, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/096
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board comprises a resin-filled plated (RFP) through-hole; a dielectric layer over the RFP through-hole; a substantially circular RFP cap in the dielectric layer and connected to an upper opening of the RFP through-hole; a via stack in the dielectric layer; and a plurality of via lands extending radially outward from the via stack, wherein each of the plurality of via lands is diametrically larger than the RFP cap. Preferably, the RFP cap comprises a diameter of at least 300 μm. Preferably, each of the via lands comprises a substantially circular shape having a diameter of at least 400 μm. Moreover, the circuit board further comprises a ball grid array pad connected to the via stack; and input/output ball grid array pads connected to the ball grid array pad. Additionally, the circuit board further comprises metal planes in the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.