Semiconductor wafer treatment method, semiconductor wafer inspection method, semiconductor device development method and semiconductor wafer treatment apparatus
US7314766B2 · kind B2 · utility
6Cited by
9References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2003 |
| Grant date | Jan 1, 2008 |
| Priority date | — |
| Expiry date | Feb 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A treatment method of a semiconductor wafer includes treating the semiconductor wafer in a first solution having at least one kind of an oxidative acid and an oxidizing agent and treating the semiconductor wafer in a second solution having at least one of HF and NH4F.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.