Method for fabricating a plurality of elastic probes in a row
US7316065B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 1, 2006 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Mar 1, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.