Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing
US7316602B2 · kind B2 · utility
5Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2003 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Dec 23, 2024 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A carrier head for holding a workpiece during processing of a workpiece surface is provided. The carrier head includes a carrier housing, a base and a pressure member. The base is configured to hold the workpiece and is movable with respect to the carrier housing. The pressure member is between the base and the carrier housing and is configured to induce the base to apply a predetermined force onto the process surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.