Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
US7317251B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2005 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Feb 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module includes at least one first semiconductor chip and at least one second semiconductor chip. The semiconductor chips are arranged in coplanar fashion on or in a support medium and respectively include matching components and contact areas arranged on their active top sides. At least one second semiconductor chip includes an arrangement of contact areas which is mirror-inverted in relation to a first semiconductor chip. At least one first semiconductor chip and at least one second semiconductor chip are arranged next to and/or behind one another (i.e., adjacent to one another) such that those of their edges which respectively have a matching arrangement of contact areas are opposite one another. Wiring arrangements extend between respectively opposite contact areas and between contact areas at the outer edges of the semiconductor chips and external contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.