Particle trap for electrostatic chuck
US7317606B2 · kind B2 · utility
3Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2005 |
| Grant date | Jan 8, 2008 |
| Priority date | — |
| Expiry date | Oct 9, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Wafer supporting apparatus, including an electrostatic chuck for supporting the wafer. The apparatus further includes an electrostatic shield which is positioned in proximity to the chuck and the wafer, and a voltage source which is coupled to apply an electric field between the chuck and the wafer. The voltage source applies one or more potentials to the electrostatic shield so as to prevent penetration of particles to the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.