Semiconductor chip assembly with precision-formed metal pillar
US7319265B1 · kind B1 · utility
14Cited by
153References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Jun 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal pillar includes tapered sidewalls with first and second sidewall portions and a spike, and the first and second sidewall portions are concave arcs that are adjacent to one another at the spike.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.