Double side polished wafer scratch inspection tool
US7319518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2005 |
| Grant date | Jan 15, 2008 |
| Priority date | — |
| Expiry date | Mar 31, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8864
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention is a method of inspecting a semiconductor wafer surface for scratches. The method includes positioning a semiconductor wafer for illumination by a radiation source and adjacent a background material that will absorb radiation from the radiation source, directing radiation at a surface of the wafer from the radiation source that has a wavelength that will be absorbed by the fundamental absorption of the wafer, filtering or otherwise limiting the radiation to allow only radiation having wavelengths that are absorbed by the fundamental absorption of the wafer to pass, and detecting radiation scattered on the surface of the wafer and filtered, by position, to thereby identify the location of the scratches on the surface of the wafer, while the absorption of the background material prevents other radiation from the source from interfering with the detection of the scratch-scattered radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.