Electronic component with a housing package

US7319598B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Rainer Steiner · Regensburg, DE
• Horst Theuss · Wenzenbach, DE

Key dates

• Filing date: Jun 25, 2003
• Grant date: Jan 15, 2008
• Expiry date: Aug 25, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K1/185
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an electronic component with a housing package comprising a number of layers of plastic with at least one buried interconnect layer and with at least one semiconductor chip, which has pointed-conical external contacts distributed on an outer side. The pointed-conical external contacts penetrate through one of the layers of plastic and form contact vias with respect to the buried interconnect layer. Furthermore, the invention relates to a method for producing such an electronic component.