Inventor · Regensburg, DE

Rainer Steiner

16Patents

6h-index

26Co-inventors

62Inventor score

Filing activity: Jun 25, 2003 → Jul 10, 2013

Most-cited inventions

Patent	Title	Area	Cited by	Status
US8330273B2	Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip	Electricity	20	Active
US7863088B2	Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound	Electricity	17	Active
US7319598B2	Electronic component with a housing package	Electricity	14	Expired
US7009288B2	Semiconductor component with electromagnetic shielding device	Electricity	13	Expired
US8148257B1	Semiconductor structure and method for making same	Electricity	11	Active
US7638418B2	Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same	Emerging Cross-Sectional Technologies	6	Active
US8659135B2	Semiconductor device stack and method for its production	Emerging Cross-Sectional Technologies	4	Active
US8334202B2	Device fabricated using an electroplating process	Electricity	2	Active
US8330274B2	Semiconductor structure and method for making same	Electricity	2	Active
US9658296B2	Current sensor device	Electricity	1	Active
US8786085B2	Semiconductor structure and method for making same	Electricity	0	Active
US8759207B2	Semiconductor structure and method for making same	Electricity	0	Active
US8072071B2	Semiconductor device including conductive element	Electricity	0	Active
US7327023B2	Semiconductor component with plastic housing, and process for producing the same	Electricity	0	Expired
US9041226B2	Chip arrangement and a method of manufacturing a chip arrangement	Electricity	0	Active
US7772105B2	Semiconductor component with plastic housing, and process for producing the same	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.