Method to improve heat dissipation in a magnetic shield
US7320168B2 · kind B2 · utility
9Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2003 |
| Grant date | Jan 22, 2008 |
| Priority date | — |
| Expiry date | Mar 7, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.